Mediating Lithium Plating/Stripping by Constructing 3D Au@Cu Pentagonal Pyramid Array

Lithium (Li) metal is perceived as the “holy grail” of anodes for secondary batteries due to its innate merits. Regrettably, commercial application Li (LMAs) has been hampered by problems derived from uncontrollable growth dendrites, which could result in formation short-circuits, thereby leading fatal safety accidents. Here, a three-dimensional lithiophilic gold (Au)-coated copper (Cu) pentagonal pyramid array (Au@CuPPA) constructed on planar Cu foil via electrodeposition followed chemical reduction method. Owing features layer and 3D porous structure, proposed Au@CuPPA can not only facilitate Li-ion migration charge transfer, but also effectively diminish nucleation overpotential. Consequently, an even steady plating/stripping process up 460 h with capacity 3 mAh cm−2 accomplished using current collector. The Li@Au@CuPPA|LiFePO4 full cell achieves high Coulombic efficiency (CE) 99.4% 150 cycles at 0.5 C retention 92.4%.